Expo · electronics · software · semiconductors · packaging
IC & Sensor Packaging EXPO Japan - Tokyo
17–19 Feb 2027
Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan
About
Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...
IC & Sensor Packaging EXPO Japan in Tokyo is Asia's leading exhibition for IC final manufacturing. It connects professionals with advanced equipment, materials, and services. The show covers electronics, software, manufacturing, materials, packaging, and semiconductors. There's a strong focus on assembly equipment, packaging materials, and analysis and simulation software for IC packaging. Exhibitors present practical solutions for the final manufacturing stage, while visitors from across the industry explore new suppliers and technologies. If you work in IC packaging, semiconductor manufacturing, or related material and equipment supply, this Tokyo event gives you a focused setting to meet the people shaping the sector. Discover what's new in IC packaging equipment and materials, compare options in one place, and build connections that support your production goals.
Key facts
IC & Sensor Packaging EXPO Japan - Tokyo is a trade show for electronics, software, semiconductors, packaging held 17–19 Feb 2027 at Tokyo International Exhibition Center (Tokyo Big Sight) in Tokyo, Japan.
- Industries
- electronics, software, semiconductors, packaging
- Venue
- Tokyo International Exhibition Center (Tokyo Big Sight)
- Listing source
- From trade-fair directories and venue calendars
- Last updated
- 1 November 2026