IC & Sensor Packaging EXPO Japan - Osaka

About

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

IC & Sensor Packaging EXPO Japan – Osaka brings Asia's leading exhibition for IC final manufacturing to Osaka, Japan. Advanced equipment, materials and services are all gathered under one roof, giving trade professionals a practical look at assembly equipment, packaging materials and equipment, and analysis and simulation software for IC packaging. Exhibitors span electronics, software, manufacturing, machinery, packaging and semiconductors, so visitors can compare suppliers and source solutions across the entire production chain. Whether you work in semiconductor packaging, IC assembly or electronics manufacturing, the expo connects you with the tools and partners that keep final manufacturing running. With Osaka's position as a manufacturing hub, the city is a natural setting for the event, and the focused floor plan helps buyers and engineers move efficiently between stands. Plan your visit to IC & Sensor Packaging EXPO Japan – Osaka to explore packaging technologies, meet suppliers and stay current with developments in IC final manufacturing across Asia.

Key facts

IC & Sensor Packaging EXPO Japan - Osaka is a trade show for electronics, software, semiconductors, machinery held 12–14 May 2027 at Intex Osaka in Osaka, Japan.

Industries

electronics, software, semiconductors, machinery

Venue

Intex Osaka

Official website

nepconjapan.jp/osaka/ja-jp.html

Listing source

From trade-fair directories and venue calendars

Last updated

1 November 2026