IC & Sensor Packaging EXPO Japan - Nagoya

About

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

IC & Sensor Packaging EXPO Japan - Nagoya brings Asia's leading exhibition for IC final manufacturing to Nagoya, Japan. You'll find advanced equipment, materials, and services that support the semiconductor industry. The focus? Assembly equipment, packaging materials and equipment, plus analysis and simulation software for IC packaging. Exhibitors come from electronics, manufacturing, materials, packaging, and semiconductors, so trade visitors get a practical look at the technologies shaping final manufacturing. Professionals across the supply chain attend to compare solutions, meet suppliers, and follow developments in IC packaging. If your work touches semiconductor packaging or electronics production, this Nagoya trade show offers a focused setting to source products and build industry connections in Japan.

Key facts

IC & Sensor Packaging EXPO Japan - Nagoya is a trade show for electronics, semiconductors, packaging, materials held 25–27 Nov 2026 at Nagoya International Exhibition Hall (Port Messe Nagoya) in Nagoya, Japan.

Industries

electronics, semiconductors, packaging, materials

Venue

Nagoya International Exhibition Hall (Port Messe Nagoya)

Official website

nepconjapan.jp/hub/ja-jp.html

Listing source

From trade-fair directories and venue calendars

Last updated

1 November 2026