OCT272027
Expo · semiconductors · electronics · manufacturing
IC Packaging FAIR
27–29 Oct 2027
Shenzhen World Exhibition & Convention Center, Shenzhen, China
About
IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
Key facts
IC Packaging FAIR is a trade show for semiconductors, electronics, manufacturing held 27–29 Oct 2027 at Shenzhen World Exhibition & Convention Center in Shenzhen, China.
- Industries
- semiconductors, electronics, manufacturing
- Venue
- Shenzhen World Exhibition & Convention Center
- Listing source
- From trade-fair directories and venue calendars
- Last updated
- 15 November 2026