Adhesion & Bonding EXPO - Osaka

About

International Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion...

Adhesion & Bonding EXPO in Osaka brings the world's joining technologies together under one roof in Japan. As the leading industrial adhesion expo, it connects engineers and buyers with the full range of bonding and joining equipment—from advanced materials and adhesives to welding, friction stirring, ultrasonic and diffusion processes. Exhibitors span construction, chemicals, manufacturing, machinery, materials and automotive. That makes the show a practical meeting point for anyone sourcing adhesive technologies or comparing joining methods. Work in production engineering, product design or procurement? The Osaka edition puts suppliers and technical specialists within easy reach. You can evaluate equipment, discuss applications and build partnerships that support cleaner, stronger assemblies. The international trade fair for adhesive and joining technologies draws a focused professional audience and gives exhibitors direct access to Japan's industrial supply chain. Plan your visit around the product categories that match your projects, and use the directory to connect with the right exhibitors before you travel.

Key facts

Adhesion & Bonding EXPO - Osaka is a trade show for construction, machinery, materials, chemicals held 12–14 May 2027 at Intex Osaka in Osaka, Japan.

Industries

construction, machinery, materials, chemicals

Venue

Intex Osaka

Listing source

From trade-fair directories and venue calendars

Last updated

1 November 2026