OCT272026
Expo · semiconductors · electronics · packaging · manufacturing
IC Packaging FAIR
27 Oct 2026 — 29 Oct 2026
Shenzhen World Exhibition & Convention Center, Shenzhen, China
About
IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...